YINCAE SMT 256/BP256

錫球保護材料, 取代Under Fill

Applied by Dipping, screen printing and dispensing

Enhance solder joint reliability and eliminate solder joint cracking for CSP, BGA, Flip chip and PoP (package on package), particularly for lead free application / Replace underfill material

產品資訊

特性:無鉛應用/替換底部填充材料

市場應用:半導體

市場應用2:光學元件

顏色:透明色/黑色

認證:RoHS/HF

品牌:YINCAE