YINCAE SMT 158

奈米級底部填充

Filler size <5nm

Combination of capillary flow and no-flow underfill, rapid curing, fast flowing liquid epoxy which can be used as an underfill for flip chip, chip scale package, BGA devices, PoP and LGA application.

產品資訊

特性:奈米級底部填充

市場應用:半導體

市場應用2:光學元件

顏色:白色/黑色

認證:RoHS/HF

品牌:YINCAE